JPH0337682B2 - - Google Patents
Info
- Publication number
- JPH0337682B2 JPH0337682B2 JP57134792A JP13479282A JPH0337682B2 JP H0337682 B2 JPH0337682 B2 JP H0337682B2 JP 57134792 A JP57134792 A JP 57134792A JP 13479282 A JP13479282 A JP 13479282A JP H0337682 B2 JPH0337682 B2 JP H0337682B2
- Authority
- JP
- Japan
- Prior art keywords
- light beam
- line
- lead
- along
- bend
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US28992181A | 1981-08-03 | 1981-08-03 | |
US289921 | 1981-08-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5870110A JPS5870110A (ja) | 1983-04-26 |
JPH0337682B2 true JPH0337682B2 (en]) | 1991-06-06 |
Family
ID=23113744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57134792A Granted JPS5870110A (ja) | 1981-08-03 | 1982-08-03 | リ−ド整列状態検査装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5870110A (en]) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4510806A (en) * | 1983-04-27 | 1985-04-16 | Universal Instruments Corporation | Gauging method and apparatus for components having leads |
JPS6076134A (ja) * | 1983-09-30 | 1985-04-30 | Nec Kansai Ltd | 軸状部材の外観検査装置 |
JPS60213041A (ja) * | 1984-04-09 | 1985-10-25 | Sanwa Electron Kk | Icのピンの状態検出装置 |
JPS60229355A (ja) * | 1984-04-27 | 1985-11-14 | Sanwa Electron Kk | Icのピンの状態検出方法 |
JPS60229356A (ja) * | 1984-04-27 | 1985-11-14 | Sanwa Electron Kk | Icのピンの曲がり検出方法 |
JPS6174346A (ja) * | 1984-09-19 | 1986-04-16 | Kokusai Syst Sci Kk | Dipタイプのデバイス検査方法 |
US4696047A (en) * | 1985-02-28 | 1987-09-22 | Texas Instruments Incorporated | Apparatus for automatically inspecting electrical connecting pins |
JPS61279146A (ja) * | 1985-06-05 | 1986-12-09 | Nhk Spring Co Ltd | 電子部品の脚片の不良検出装置 |
JPS61283200A (ja) * | 1985-06-10 | 1986-12-13 | 国際システムサイエンス株式会社 | Icのピン曲りチエツカ− |
DE3689406T2 (de) * | 1985-10-11 | 1994-06-16 | Hitachi Keiyo Eng | Verfahren zur Plazierung eines oberflächenmontierten Teiles und eine Vorrichtung dazu. |
US5189707A (en) * | 1985-10-11 | 1993-02-23 | Hitachi, Ltd. | Method of loading surface mounted device and an apparatus therefor |
JPH0815178B2 (ja) * | 1987-02-09 | 1996-02-14 | ダックエンジニアリング株式会社 | Ic外観検査方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5365071A (en) * | 1976-11-22 | 1978-06-10 | Nec Corp | External lead bend detector of electronic parts |
JPS5663275A (en) * | 1979-10-30 | 1981-05-29 | Nec Kyushu Ltd | Lead testing device for semiconductor device |
-
1982
- 1982-08-03 JP JP57134792A patent/JPS5870110A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5870110A (ja) | 1983-04-26 |
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